Fiscal 2007 : Hitachi Cable

The Hitachi Cable group actively conducts research and development activities, ranging from the development of new materials and new products to the development of production technologies, in an effort to create original and innovative technologies.
We have created a new post (Chief Technology Officer, or CTO) and have restructured our research and development organizations into the Corporate Advanced Technology Group and the Research & Development Group. The former formulates and monitors the research and development strategies, whereas the latter carries out the actual research and development. This new structure will enable us to develop new products and new technologies ahead of our competitors, and thus get them to market earlier.
The actual research and development work is mainly carried out by the Research & Development Group, which consists of the Materials Technology Research & Development Center, the Electronic Materials Research & Development Center, the Photonics Research & Development Center, and the Cross Technology Development Center; the ITS (Intelligent Transport Systems) Development Office; and the design and development sections of each business division.
We also maintain close communication and cooperative relationships with the research and development organizations of the Hitachi Group companies including Hitachi, Ltd., and promote joint research with customers and governmental research and development institutions as needed, thus achieving effective research and development of advanced technologies.
The following describes the research and development topics addressed by our company group in each business section and the achievements of those activities in the consolidated fiscal year 2007 ended March 31, 2007. Total research and development expenditures during the consolidated fiscal year totaled 10 billion yen.

Wires and Cables Business

R&D covers a range of products in industrial wires and cables, and transmission and connection technologies for electronic equipment. R&D expenses were 2,016 million yen.
The main achievements in the consolidated fiscal year 2007 are indicated below.

Development of halogen-free flame-retardant cables for the Taipei Department of Rapid Transit Systems
Development of environment-friendly flexible cables for elevators (EVVL-Fixed type)
Development of environment-friendly rubber cabtire cables
Development of environment- friendly cables for solar cell modules
Development of fiber optic methane gas detection system
Development of communication technology for automated material handling system
Development of thermal analysis technology for bullet train power cables
Development of solder-coated, soft-annealed flat wire
Development of halogen-free flame-retardant wires rated 105ºC for electrical appliances
Development of whisker-suppressed tin-plated FFC
Development of micro coaxial cable (48 AWG)
Development of antenna optimization design method based on PC cluster and genetic algorithm

Section of micro coaxial cable
left:Using 48 AWG conductor / right:Using 46 AWG Conductor

Information and Telecommunications Networking Business

R&D in this segment focuses on fiber optic and other types of cables and sensors for telecommunications, various devices and components necessary for Internet or mobile phone systems, and network equipment, antennas for mobile phone base stations, and products for next-generation Intelligent Transport Systems. R&D expenses in this division totaled 3,744 million yen.
The main achievements in the consolidated fiscal year 2007 are indicated below.

Development of Layer 2 switching hub for nextgeneration networks (5 slots; up to 10 Gbit/s x 10 port switching)
Development of box-type Layer 2/3 switching hub (10 Gbit/s x 2 ports + 1 Gbit/s x 48 ports)
Development of Restriction of Hazardous Substances (RoHS) compliance Layer 2/3 switching hub (10/100 M/s x 24 ports + 1 Gbit/s x 2 ports; total 9 device types)
Development of compact, temperature independent, low-loss optical multiplexer / demultiplexer modules (one-tenth former size)
Development of mass-production technology for optical transceivers for 10Gbit/s Ethernet and 4Gbit/s fiber channel

Apresia13000-48X

Sophisticated Materials Business

R&D expenses in this division totaled 4,238 million yen.R&D in this segment is broadly divided into the following three fields.

A. Semiconductor Package Materials & Electronic Components Field

R&D in this field focuses on technologies to respond to the miniaturization and greater sophistication of mobile phones and other IT devices, and higher definition LCDs. Research areas include fine micromanufacturing, lamination, and plating technologies for TAB tapes and circuit boards; the growth of semiconductor single crystals for GaAs and other compound semiconductor materials; and epitaxial wafers for semiconductor elements in addition to their applications and related products.
The main achievements in the consolidated fiscal year 2007 are indicated below.

Development of epitaxial wafer for 2-wavelength laser diodes for writing
Commercialization of epitaxial wafer for highvoltageresistance, high-efficiency GaN-HEMT for mobile phone base stations
Development of multi stacked packages (Package on Package)
Development of fine-pitch bimetal tape production techniques
Development of fine-pitch COF tape developed with a new etching method

Example of multi stacked packages

B. Copper Products Field

R&D in this field focuses on copper strips used in electronic components, heat transfer tubes used in heat exchange devices, and system products based on these products. Other research areas include metallic superconductor materials and hightemperature oxide superconductors.
The main achievements in the consolidated fiscal year 2007 are indicated below.

Development of high bendable rolled copper foil for the next generation (OFC-HX)
Development of 6-µm thickness rolled copper and copper alloy foil
Establishment of mass production techniques for high-strength Corson alloy
Establishment of cut production technology of dual-gauge copper strips
Development of oxygen-free copper products for flat-panel displays (FPDs)
Development of high-performance heatexchange materials for Ecocute*
Development of lightweight, high-helix angle TFIN tube (7Ø-40º ; 8Ø-45º )

* Ecocute is a registered trademark of Kansai Electric Power Co., Inc.

Ultra-thin rolled copper foil

C. Automotive Parts Field

The primary areas of R&D in this division are automotive hoses such as brake and power steering hoses, and automotive electronics and components for IT devices.
The main achievements in the consolidated fiscal year 2007 are indicated below.

Development of dual-layer separation rollers for scanners